Classifications for Disco Corp

H01L
Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
B23K
Soldering Or Unsoldering; Welding; Cladding Or Plating By Soldering Or Welding; Cutting By Applying Heat Locally, E.g. Flame Cutting; Working By Laser Beam
B24B
Machines, Devices, Or Processes For Grinding Or Polishing ; Dressing Or Conditioning Of Abrading Surfaces; Feeding Of Grinding, Polishing, Or Lapping Agents
B28D
Working Stone Or Stone-like Materials
B23Q
Details, Components, Or Accessories For Machine Tools, E.g. Arrangements For Copying Or Controlling ; Machine Tools In General Characterised By The Construction Of Particular Details Or Components; Combinations Or Associations Of Metal-working Machines, Not Directed To A Particular Result